MEMS switch with set and latch electrodes

ABSTRACT

A MEMS device is electrically actuated with a voltage placed across a first electrode and a moveable material. The device may be maintained in an actuated state by latch electrodes that are separate from the first electrode.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 11/234,826,titled “MEMS Switch With Set And Latch Electrodes,” filed Sep. 23, 2005,which claims priority to U.S. Provisional Application No. 60/613,501,titled “Interferometric Modulator Array With Integrated MEMS ElectricalSwitches,” filed Sep. 27, 2004, which is hereby incorporated byreference, in its entirety.

BACKGROUND

1. Field of the Invention

The field of the invention relates to microelectromechanical systems(MEMS).

2. Description of the Related Technology

Microelectromechanical systems (MEMS) include micro mechanical elements,actuators, and electronics. Micromechanical elements may be createdusing deposition, etching, and or other micromachining processes thatetch away parts of substrates and/or deposited material layers or thatadd layers to form electrical and electromechanical devices. One type ofMEMS device is called an interferometric modulator. As used herein, theterm interferometric modulator or interferometric light modulator refersto a device that selectively absorbs and/or reflects light using theprinciples of optical interference. In certain embodiments, aninterferometric modulator may comprise a pair of conductive plates, oneor both of which may be transparent and/or reflective in whole or partand capable of relative motion upon application of an appropriateelectrical signal. In a particular embodiment, one plate may comprise astationary layer deposited on a substrate and the other plate maycomprise a metallic membrane separated from the stationary layer by anair gap. As described herein in more detail, the position of one platein relation to another can change the optical interference of lightincident on the interferometric modulator. Such devices have a widerange of applications, and it would be beneficial in the art to utilizeand/or modify the characteristics of these types of devices so thattheir features can be exploited in improving existing products andcreating new products that have not yet been developed.

SUMMARY OF CERTAIN EMBODIMENTS

The system, method, and devices of the invention each have severalaspects, no single one of which is solely responsible for its desirableattributes. Without limiting the scope of this invention, its moreprominent features will now be discussed briefly. After considering thisdiscussion, and particularly after reading the section entitled“Detailed Description of Certain Embodiments” one will understand howthe features of this invention provide advantages over other displaydevices.

In one embodiment, the invention includes a MEMS device comprising asubstrate with at least two support posts supported by the substrate.The device also includes at least two electrically isolated electrodessupported by the substrate and positioned between the support posts. Thedevice further includes a moveable electrode supported above thesubstrate by the support posts, and at least two switch terminals thatare selectably connectable depending on the position of the moveableelectrode.

In another embodiment, the invention includes a method of operating aMEMS switch. The method includes controlling switch actuation by movinga moveable element from a first position to a second position byapplying a first voltage across a first electrode and second electrode.The method also includes maintaining the moveable element in the secondposition by applying a second voltage across the first electrode and athird electrode.

In another embodiment, a MEMS switch includes a first electrode moveablebetween first and second positions and switch terminals selectablyconnectable based on a position of the moveable electrode. The switchalso includes means for moving the moveable electrode from the firstposition to the second position, and means for maintaining the moveableelectrode in the second position. The means for maintaining isseparately controllable from the means for moving.

In another embodiment, the invention comprises a method of making a MEMSswitch. The method includes forming at least first and secondelectrically isolated electrodes between a pair of support posts on asubstrate, forming switch terminals, and forming a moveable electrode onsaid support posts.

In another embodiment, a display system comprises an array of MEMSdisplay elements one or more MEMS switches coupled to the array. Atleast one of the MEMS switches comprises a substrate, at least twosupport posts supported by the substrate, and at least two electricallyisolated electrodes supported by said substrate and positioned betweenthe support posts. A moveable electrode is supported above the substrateby the support posts; and at least two switch terminals are providedthat are selectably connectable depending on the position of themoveable electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view depicting a portion of one embodiment of aninterferometric modulator display in which a movable reflective layer ofa first interferometric modulator is in a relaxed position and a movablereflective layer of a second interferometric modulator is in an actuatedposition.

FIG. 2 is a system block diagram illustrating one embodiment of anelectronic device incorporating a 3×3 interferometric modulator display.

FIG. 3 is a diagram of movable mirror position versus applied voltagefor one exemplary embodiment of an interferometric modulator of FIG. 1.

FIG. 4 is an illustration of a set of row and column voltages that maybe used to drive an interferometric modulator display.

FIGS. 5A and 5B illustrate one exemplary timing diagram for row andcolumn signals that may be used to write a frame of display data to the3×3 interferometric modulator display of FIG. 2.

FIGS. 6A and 6B are system block diagrams illustrating an embodiment ofa visual display device comprising a plurality of interferometricmodulators.

FIG. 7A is a cross section of the device of FIG. 1.

FIG. 7B is a cross section of an alternative embodiment of aninterferometric modulator.

FIG. 7C is a cross section of another alternative embodiment of aninterferometric modulator.

FIG. 7D is a cross section of yet another alternative embodiment of aninterferometric modulator.

FIG. 7E is a cross section of an additional alternative embodiment of aninterferometric modulator.

FIG. 8A is a cross section of a MEMS switch embodiment.

FIG. 8B is a top view of the switch embodiment of FIG. 8A

FIG. 9 is a cross section of another MEMS switch embodiment.

FIG. 10 is a cross section of another MEMS switch embodiment.

FIG. 11 is a schematic/block diagram of the switch embodiment of FIG.10.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

The following detailed description is directed to certain specificembodiments of the invention. However, the invention can be embodied ina multitude of different ways. In this description, reference is made tothe drawings wherein like parts are designated with like numeralsthroughout. As will be apparent from the following description, theembodiments may be implemented in any device that is configured todisplay an image, whether in motion (e.g., video) or stationary (e.g.,still image), and whether textual or pictorial. More particularly, it iscontemplated that the embodiments may be implemented in or associatedwith a variety of electronic devices such as, but not limited to, mobiletelephones, wireless devices, personal data assistants (PDAs), hand-heldor portable computers, GPS receivers/navigators, cameras, MP3 players,camcorders, game consoles, wrist watches, clocks, calculators,television monitors, flat panel displays, computer monitors, autodisplays (e.g., odometer display, etc.), cockpit controls and/ordisplays, display of camera views (e.g., display of a rear view camerain a vehicle), electronic photographs, electronic billboards or signs,projectors, architectural structures, packaging, and aestheticstructures (e.g., display of images on a piece of jewelry). MEMS devicesof similar structure to those described herein can also be used innon-display applications such as in electronic switching devices.

One interferometric modulator display embodiment comprising aninterferometric MEMS display element is illustrated in FIG. 1. In thesedevices, the pixels are in either a bright or dark state. In the bright(“on” or “open”) state, the display element reflects a large portion ofincident visible light to a user. When in the dark (“off” or “closed”)state, the display element reflects little incident visible light to theuser. Depending on the embodiment, the light reflectance properties ofthe “on” and “off” states may be reversed. MEMS pixels can be configuredto reflect predominantly at selected colors, allowing for a colordisplay in addition to black and white.

FIG. 1 is an isometric view depicting two adjacent pixels in a series ofpixels of a visual display, wherein each pixel comprises a MEMSinterferometric modulator. In some embodiments, an interferometricmodulator display comprises a row/column array of these interferometricmodulators. Each interferometric modulator includes a pair of reflectivelayers positioned at a variable and controllable distance from eachother to form a resonant optical cavity with at least one variabledimension. In one embodiment, one of the reflective layers may be movedbetween two positions. In the first position, referred to herein as therelaxed position, the movable reflective layer is positioned at arelatively large distance from a fixed partially reflective layer. Inthe second position, referred to herein as the actuated position, themovable reflective layer is positioned more closely adjacent to thepartially reflective layer. Incident light that reflects from the twolayers interferes constructively or destructively depending on theposition of the movable reflective layer, producing either an overallreflective or non-reflective state for each pixel.

The depicted portion of the pixel array in FIG. 1 includes two adjacentinterferometric modulators 12 a and 12 b. In the interferometricmodulator 12 a on the left, a movable reflective layer 14 a isillustrated in a relaxed position at a predetermined distance from anoptical stack 16 a, which includes a partially reflective layer. In theinterferometric modulator 12 b on the right, the movable reflectivelayer 14 b is illustrated in an actuated position adjacent to theoptical stack 16 b.

The optical stacks 16 a and 16 b (collectively referred to as opticalstack 16), as referenced herein, typically comprise of several fusedlayers, which can include an electrode layer, such as indium tin oxide(ITO), a partially reflective layer, such as chromium, and a transparentdielectric. The optical stack 16 is thus electrically conductive,partially transparent and partially reflective, and may be fabricated,for example, by depositing one or more of the above layers onto atransparent substrate 20. The partially reflective layer can be formedof one or more layers of materials, and each of the layers can be formedof a single material or a combination of materials.

In some embodiments, the layers of the optical stack are patterned intoparallel strips, and may form row electrodes in a display device asdescribed further below. The movable reflective layers 14 a, 14 b may beformed as a series of parallel strips of a deposited metal layer orlayers (orthogonal to the row electrodes of 16 a, 16 b) deposited on topof posts 18 and an intervening sacrificial material deposited betweenthe posts 18. When the sacrificial material is etched away, the movablereflective layers 14 a, 14 b are separated from the optical stacks 16 a,16 b by a defined gap 19. A highly conductive and reflective materialsuch as aluminum may be used for the reflective layers 14, and thesestrips may form column electrodes in a display device.

With no applied voltage, the cavity 19 remains between the movablereflective layer 14 a and optical stack 16 a, with the movablereflective layer 14 a in a mechanically relaxed state, as illustrated bythe pixel 12 a in FIG. 1. However, when a potential difference isapplied to a selected row and column, the capacitor formed at theintersection of the row and column electrodes at the corresponding pixelbecomes charged, and electrostatic forces pull the electrodes together.If the voltage is high enough, the movable reflective layer 14 isdeformed and is forced against the optical stack 16. A dielectric layer(not illustrated in this Figure) within the optical stack 16 may preventshorting and control the separation distance between layers 14 and 16,as illustrated by pixel 12 b on the right in FIG. 1. The behavior is thesame regardless of the polarity of the applied potential difference. Inthis way, row/column actuation that can control the reflective vs.non-reflective pixel states is analogous in many ways to that used inconventional LCD and other display technologies.

FIGS. 2 through 5 illustrate one exemplary process and system for usingan array of interferometric modulators in a display application.

FIG. 2 is a system block diagram illustrating one embodiment of anelectronic device that may incorporate aspects of the invention. In theexemplary embodiment, the electronic device includes a processor 21which may be any general purpose single- or multi-chip microprocessorsuch as an ARM, Pentium®, Pentium II®, Pentium III®, Pentium IV®,Pentium® Pro, an 8051, a MIPS®, a Power PC®, an ALPHA®, or any specialpurpose microprocessor such as a digital signal processor,microcontroller, or a programmable gate array. As is conventional in theart, the processor 21 may be configured to execute one or more softwaremodules. In addition to executing an operating system, the processor maybe configured to execute one or more software applications, including aweb browser, a telephone application, an email program, or any othersoftware application.

In one embodiment, the processor 21 is also configured to communicatewith an array driver 22. In one embodiment, the array driver 22 includesa row driver circuit 24 and a column driver circuit 26 that providesignals to a display array or panel 30. The cross section of the arrayillustrated in FIG. 1 is shown by the lines 1-1 in FIG. 2. For MEMSinterferometric modulators, the row/column actuation protocol may takeadvantage of a hysteresis property of these devices illustrated in FIG.3. It may require, for example, a 10 volt potential difference to causea movable layer to deform from the relaxed state to the actuated state.However, when the voltage is reduced from that value, the movable layermaintains its state as the voltage drops back below 10 volts. In theexemplary embodiment of FIG. 3, the movable layer does not relaxcompletely until the voltage drops below 2 volts. There is thus a rangeof voltage, about 3 to 7 V in the example illustrated in FIG. 3, wherethere exists a window of applied voltage within which the device isstable in either the relaxed or actuated state. This is referred toherein as the “hysteresis window” or “stability window.” For a displayarray having the hysteresis characteristics of FIG. 3, the row/columnactuation protocol can be designed such that during row strobing, pixelsin the strobed row that are to be actuated are exposed to a voltagedifference of about 10 volts, and pixels that are to be relaxed areexposed to a voltage difference of close to zero volts. After thestrobe, the pixels are exposed to a steady state voltage difference ofabout 5 volts such that they remain in whatever state the row strobe putthem in. After being written, each pixel sees a potential differencewithin the “stability window” of 3-7 volts in this example. This featuremakes the pixel design illustrated in FIG. 1 stable under the sameapplied voltage conditions in either an actuated or relaxed pre-existingstate. Since each pixel of the interferometric modulator, whether in theactuated or relaxed state, is essentially a capacitor formed by thefixed and moving reflective layers, this stable state can be held at avoltage within the hysteresis window with almost no power dissipation.Essentially no current flows into the pixel if the applied potential isfixed.

In typical applications, a display frame may be created by asserting theset of column electrodes in accordance with the desired set of actuatedpixels in the first row. A row pulse is then applied to the row 1electrode, actuating the pixels corresponding to the asserted columnlines. The asserted set of column electrodes is then changed tocorrespond to the desired set of actuated pixels in the second row. Apulse is then applied to the row 2 electrode, actuating the appropriatepixels in row 2 in accordance with the asserted column electrodes. Therow 1 pixels are unaffected by the row 2 pulse, and remain in the statethey were set to during the row 1 pulse. This may be repeated for theentire series of rows in a sequential fashion to produce the frame.Generally, the frames are refreshed and/or updated with new display databy continually repeating this process at some desired number of framesper second. A wide variety of protocols for driving row and columnelectrodes of pixel arrays to produce display frames are also well knownand may be used in conjunction with the present invention.

FIGS. 4 and 5 illustrate one possible actuation protocol for creating adisplay frame on the 3×3 array of FIG. 2. FIG. 4 illustrates a possibleset of column and row voltage levels that may be used for pixelsexhibiting the hysteresis curves of FIG. 3. In the FIG. 4 embodiment,actuating a pixel involves setting the appropriate column to—V_(bias),and the appropriate row to +ΔV, which may correspond to −5 volts and +5volts respectively Relaxing the pixel is accomplished by setting theappropriate column to +V_(bias), and the appropriate row to the same+ΔV, producing a zero volt potential difference across the pixel. Inthose rows where the row voltage is held at zero volts, the pixels arestable in whatever state they were originally in, regardless of whetherthe column is at +V_(bias), or −V_(bias). As is also illustrated in FIG.4, it will be appreciated that voltages of opposite polarity than thosedescribed above can be used, e.g., actuating a pixel can involve settingthe appropriate column to +V_(bias), and the appropriate row to −ΔV. Inthis embodiment, releasing the pixel is accomplished by setting theappropriate column to −V_(bias), and the appropriate row to the same−ΔV, producing a zero volt potential difference across the pixel.

FIG. 5B is a timing diagram showing a series of row and column signalsapplied to the 3×3 array of FIG. 2 which will result in the displayarrangement illustrated in FIG. 5A, where actuated pixels arenon-reflective. Prior to writing the frame illustrated in FIG. 5A, thepixels can be in any state, and in this example, all the rows are at 0volts, and all the columns are at +5 volts. With these applied voltages,all pixels are stable in their existing actuated or relaxed states.

In the FIG. 5A frame, pixels (1,1), (1,2), (2,2), (3,2) and (3,3) areactuated. To accomplish this, during a “line time” for row 1, columns 1and 2 are set to −5 volts, and column 3 is set to +5 volts. This doesnot change the state of any pixels, because all the pixels remain in the3-7 volt stability window. Row 1 is then strobed with a pulse that goesfrom 0, up to 5 volts, and back to zero. This actuates the (1,1) and(1,2) pixels and relaxes the (1,3) pixel. No other pixels in the arrayare affected. To set row 2 as desired, column 2 is set to −5 volts, andcolumns 1 and 3 are set to +5 volts. The same strobe applied to row 2will then actuate pixel (2,2) and relax pixels (2,1) and (2,3). Again,no other pixels of the array are affected. Row 3 is similarly set bysetting columns 2 and 3 to −5 volts, and column 1 to +5 volts. The row 3strobe sets the row 3 pixels as shown in FIG. 5A. After writing theframe, the row potentials are zero, and the column potentials can remainat either +5 or −5 volts, and the display is then stable in thearrangement of FIG. 5A. It will be appreciated that the same procedurecan be employed for arrays of dozens or hundreds of rows and columns. Itwill also be appreciated that the timing, sequence, and levels ofvoltages used to perform row and column actuation can be varied widelywithin the general principles outlined above, and the above example isexemplary only, and any actuation voltage method can be used with thesystems and methods described herein.

FIGS. 6A and 6B are system block diagrams illustrating an embodiment ofa display device 40. The display device 40 can be, for example, acellular or mobile telephone. However, the same components of displaydevice 40 or slight variations thereof are also illustrative of varioustypes of display devices such as televisions and portable media players.

The display device 40 includes a housing 41, a display 30, an antenna43, a speaker 44, an input device 48, and a microphone 46. The housing41 is generally formed from any of a variety of manufacturing processesas are well known to those of skill in the art, including injectionmolding, and vacuum forming. In addition, the housing 41 may be madefrom any of a variety of materials, including but not limited toplastic, metal, glass, rubber, and ceramic, or a combination thereof. Inone embodiment the housing 41 includes removable portions (not shown)that may be interchanged with other removable portions of differentcolor, or containing different logos, pictures, or symbols.

The display 30 of exemplary display device 40 may be any of a variety ofdisplays, including a bi-stable display, as described herein. In otherembodiments, the display 30 includes a flat-panel display, such asplasma, EL, OLED, STN LCD, or TFT LCD as described above, or anon-flat-panel display, such as a CRT or other tube device, as is wellknown to those of skill in the art. However, for purposes of describingthe present embodiment, the display 30 includes an interferometricmodulator display, as described herein.

The components of one embodiment of exemplary display device 40 areschematically illustrated in FIG. 6B. The illustrated exemplary displaydevice 40 includes a housing 41 and can include additional components atleast partially enclosed therein. For example, in one embodiment, theexemplary display device 40 includes a network interface 27 thatincludes an antenna 43 which is coupled to a transceiver 47. Thetransceiver 47 is connected to a processor 21, which is connected toconditioning hardware 52. The conditioning hardware 52 may be configuredto condition a signal (e.g. filter a signal). The conditioning hardware52 is connected to a speaker 45 and a microphone 46. The processor 21 isalso connected to an input device 48 and a driver controller 29. Thedriver controller 29 is coupled to a frame buffer 28, and to an arraydriver 22, which in turn is coupled to a display array 30. A powersupply 50 provides power to all components as required by the particularexemplary display device 40 design.

The network interface 27 includes the antenna 43 and the transceiver 47so that the exemplary display device 40 can communicate with one oremore devices over a network. In one embodiment the network interface 27may also have some processing capabilities to relieve requirements ofthe processor 21. The antenna 43 is any antenna known to those of skillin the art for transmitting and receiving signals. In one embodiment,the antenna transmits and receives RF signals according to the IEEE802.11 standard, including IEEE 802.11(a), (b), or (g). In anotherembodiment, the antenna transmits and receives RF signals according tothe BLUETOOTH standard. In the case of a cellular telephone, the antennais designed to receive CDMA, GSM, AMPS or other known signals that areused to communicate within a wireless cell phone network. Thetransceiver 47 pre-processes the signals received from the antenna 43 sothat they may be received by and further manipulated by the processor21. The transceiver 47 also processes signals received from theprocessor 21 so that they may be transmitted from the exemplary displaydevice 40 via the antenna 43.

In an alternative embodiment, the transceiver 47 can be replaced by areceiver. In yet another alternative embodiment, network interface 27can be replaced by an image source, which can store or generate imagedata to be sent to the processor 21. For example, the image source canbe a digital video disc (DVD) or a hard-disc drive that contains imagedata, or a software module that generates image data.

Processor 21 generally controls the overall operation of the exemplarydisplay device 40. The processor 21 receives data, such as compressedimage data from the network interface 27 or an image source, andprocesses the data into raw image data or into a format that is readilyprocessed into raw image data. The processor 21 then sends the processeddata to the driver controller 29 or to frame buffer 28 for storage. Rawdata typically refers to the information that identifies the imagecharacteristics at each location within an image. For example, suchimage characteristics can include color, saturation, and gray-scalelevel.

In one embodiment, the processor 21 includes a microcontroller, CPU, orlogic unit to control operation of the exemplary display device 40.Conditioning hardware 52 generally includes amplifiers and filters fortransmitting signals to the speaker 45, and for receiving signals fromthe microphone 46. Conditioning hardware 52 may be discrete componentswithin the exemplary display device 40, or may be incorporated withinthe processor 21 or other components.

The driver controller 29 takes the raw image data generated by theprocessor 21 either directly from the processor 21 or from the framebuffer 28 and reformats the raw image data appropriately for high speedtransmission to the array driver 22. Specifically, the driver controller29 reformats the raw image data into a data flow having a raster-likeformat, such that it has a time order suitable for scanning across thedisplay array 30. Then the driver controller 29 sends the formattedinformation to the array driver 22. Although a driver controller 29,such as a LCD controller, is often associated with the system processor21 as a stand-alone Integrated Circuit (IC), such controllers may beimplemented in many ways. They may be embedded in the processor 21 ashardware, embedded in the processor 21 as software, or fully integratedin hardware with the array driver 22.

Typically, the array driver 22 receives the formatted information fromthe driver controller 29 and reformats the video data into a parallelset of waveforms that are applied many times per second to the hundredsand sometimes thousands of leads coming from the display's x-y matrix ofpixels.

In one embodiment, the driver controller 29, array driver 22, anddisplay array 30 are appropriate for any of the types of displaysdescribed herein. For example, in one embodiment, driver controller 29is a conventional display controller or a bi-stable display controller(e.g., an interferometric modulator controller). In another embodiment,array driver 22 is a conventional driver or a bi-stable display driver(e.g., an interferometric modulator display). In one embodiment, adriver controller 29 is integrated with the array driver 22. Such anembodiment is common in highly integrated systems such as cellularphones, watches, and other small area displays. In yet anotherembodiment, display array 30 is a typical display array or a bi-stabledisplay array (e.g., a display including an array of interferometricmodulators).

The input device 48 allows a user to control the operation of theexemplary display device 40. In one embodiment, input device 48 includesa keypad, such as a QWERTY keyboard or a telephone keypad, a button, aswitch, a touch-sensitive screen, a pressure- or heat-sensitivemembrane. In one embodiment, the microphone 46 is an input device forthe exemplary display device 40. When the microphone 46 is used to inputdata to the device, voice commands may be provided by a user forcontrolling operations of the exemplary display device 40.

Power supply 50 can include a variety of energy storage devices as arewell known in the art. For example, in one embodiment, power supply 50is a rechargeable battery, such as a nickel-cadmium battery or a lithiumion battery. In another embodiment, power supply 50 is a renewableenergy source, a capacitor, or a solar cell, including a plastic solarcell, and solar-cell paint. In another embodiment, power supply 50 isconfigured to receive power from a wall outlet.

In some implementations control programmability resides, as describedabove, in a driver controller which can be located in several places inthe electronic display system. In some cases control programmabilityresides in the array driver 22. Those of skill in the art will recognizethat the above-described optimization may be implemented in any numberof hardware and/or software components and in various configurations.

The details of the structure of interferometric modulators that operatein accordance with the principles set forth above may vary widely. Forexample, FIGS. 7A-7E illustrate five different embodiments of themovable reflective layer 14 and its supporting structures. FIG. 7A is across section of the embodiment of FIG. 1, where a strip of metalmaterial 14 is deposited on orthogonally extending supports 18. In FIG.7B, the moveable reflective layer 14 is attached to supports at thecorners only, on tethers 32. In FIG. 7C, the moveable reflective layer14 is suspended from a deformable layer 34, which may comprise aflexible metal. The deformable layer 34 connects, directly orindirectly, to the substrate 20 around the perimeter of the deformablelayer 34. These connections are herein referred to as support posts. Theembodiment illustrated in FIG. 7D has support post plugs 42 upon whichthe deformable layer 34 rests. The movable reflective layer 14 remainssuspended over the cavity, as in FIGS. 7A-7C, but the deformable layer34 does not form the support posts by filling holes between thedeformable layer 34 and the optical stack 16. Rather, the support postsare formed of a planarization material, which is used to form supportpost plugs 42. The embodiment illustrated in FIG. 7E is based on theembodiment shown in FIG. 7D, but may also be adapted to work with any ofthe embodiments illustrated in FIGS. 7A-7C as well as additionalembodiments not shown. In the embodiment shown in FIG. 7E, an extralayer of metal or other conductive material has been used to form a busstructure 44. This allows signal routing along the back of theinterferometric modulators, eliminating a number of electrodes that mayotherwise have had to be formed on the substrate 20.

In embodiments such as those shown in FIG. 7, the interferometricmodulators function as direct-view devices, in which images are viewedfrom the front side of the transparent substrate 20, the side oppositeto that upon which the modulator is arranged. In these embodiments, thereflective layer 14 optically shields the portions of theinterferometric modulator on the side of the reflective layer oppositethe substrate 20, including the deformable layer 34. This allows theshielded areas to be configured and operated upon without negativelyaffecting the image quality. Such shielding allows the bus structure 44in FIG. 7E, which provides the ability to separate the opticalproperties of the modulator from the electromechanical properties of themodulator, such as addressing and the movements that result from thataddressing. This separable modulator architecture allows the structuraldesign and materials used for the electromechanical aspects and theoptical aspects of the modulator to be selected and to functionindependently of each other. Moreover, the embodiments shown in FIGS.7C-7E have additional benefits deriving from the decoupling of theoptical properties of the reflective layer 14 from its mechanicalproperties, which are carried out by the deformable layer 34. Thisallows the structural design and materials used for the reflective layer14 to be optimized with respect to the optical properties, and thestructural design and materials used for the deformable layer 34 to beoptimized with respect to desired mechanical properties.

With some modifications the basic structure of an interferometricmodulator can be used as a MEMS switch. MEMS switches built from thesame basic structure as interferometric modulators ease the integrationof logic and switching functions with interferometric modulator arrays.It is possible that the other types of switches may be integrated, suchas switches fabricated in a manner not similar to the fabrication of theinterferometric elements, and more conventional electronic switchesfabricated using thin silicon films deposited on the glass substrate.However, because fabrication of interferometric modulator based MEMSswitches may be performed using many of the same processing steps thatare used in fabricating interferometric modulators, these MEMS switchesmay be inexpensively integrated onto the same substrate as an array ofinterferometric modulators used, for example, for a display.

For example, in one embodiment the MEMS switches and interferometricmodulators may be fabricated using the same process, although extrasteps may be performed on the interferometric modulators and/or the MEMSswitches during the manufacturing process. For example, deposition andetching steps to add terminals to the MEMS switches are unnecessary forthe fabrication of interferometric modulators. In such an embodimentsome common steps would be performed, such as those for forming theelectrodes, etc. The MEMS switch terminals would then be formed. Afterthese steps would follow more steps necessary for both theinterferometric modulators and the MEMS switches, thus providing acombined interferometric modulator and MEMS switch array. In yet anotherembodiment, the same process that is used for manufacturinginterferometric modulators is used in manufacturing MEMS switches. Theinterferometric modulators may first be fabricated on a substrate,followed by fabrication of MEMS switches on the substrate. Similarly,MEMS switches may first be fabricated on a substrate, followed byfabrication of interferometric modulators on the substrate. In eithercase, the manufacturing process does not require significantmodification as the MEMS switches comprise many of the same structuresas the interferometric modulators.

In one embodiment, groups of these MEMS switches can be used to formlogic blocks, which may be used for any purpose. These logic blockscomprising MEMS switches may be arranged together to provide logical andelectrical functions typically found in externally attached components,thereby saving component cost. For example, MEMS switches may bearranged for use in various manners, such as in the capacity of lowleakage transistors, shift registers, or demultiplexers, for example. Inthe context of a interferometric modulator, the above-described MEMSswitches may be used in conjunction with row drivers or column drivers,for example. Advantageously, the MEMS switches described above may bemanufactured on various substrates, such as glass, glass wafers, siliconwafers, or plastic substrates, for example.

FIG. 8A is a cross-sectional side view of a MEMS switch 700. The MEMSswitch 700 of FIG. 8A has similar collapsible cavity features as theinterferometric modulator of FIG. 7A. The MEMS switch 700 additionallyincludes two terminals 706, an insulating layer 710, and a conductivestrip 708. The MEMS switch 700 is a structure that provides selectiveelectrical contact between the two terminals 706. More particularly, theMEMS switch 700 is considered closed when the terminals 706 are inelectrical contact and the MEMS switch is considered open when theterminals 706 are not in electrical contact. In a mechanically relaxedstate, terminals 706 are not in electrical contact and, thus, the MEMSswitch 700 is open. As shown in FIG. 8A, the MEMS switch 700 comprises amoveable material 714, a conductive strip 708, and an insulating layer710 between the moveable material 714 and the conductive strip 708. Asubstrate 720 supports an electrode 702, and an insulating layer 704 onthe electrode 702. Two terminals 706, separated by a distance, aredeposited on and/or through the insulating layer 704. The terminals 706may connect to other circuitry using vias through insulating layer 704and/or electrode 702. Insulating layer 704 and moveable material 714 aremechanically separated by supports 718 in order to define a cavity 707.As described above with respect to interferometric modulators, themoveable material 714 is deformable, such that the moveable material 714may be deformed towards the substrate 720 when a voltage difference isapplied across the moveable material 714 and the electrode 702. This isanalogous to the reflective material 14, substrate 20, and electrode 16of FIG. 7A, and to the reflective layers 14 a and 14 b, the transparentsubstrate 20, and the reflective layers 16 a and 16 b of FIG. 1. Themoveable material 714 may have on it an insulator 710, which has upon itthe conductive strip 708. The conductive strip 708 is aligned so thatwhen the moveable material 714 is deflected towards the substrate 720 byan applied potential as described above, the conductive strip 708contacts both of the terminals 706, causing the terminals 706 to be inelectrical contact and the MEMS switch 700 to be closed. In thisembodiment, the conductive strip 708 is electrically isolated from themoveable material 714 by insulator 710 so that contact between theterminals 706 and the movable material 714 does not disturb the voltagedifference applied across the moveable material 714 and the electrode702. In some embodiments, where such isolation is not necessary, theconductive strip 708 and the insulator 710 will not be needed, and themoveable material itself 714 can function as the conductor that bridgesthe two terminals 706. When the voltage applied across the moveablematerial 714 and the electrode 702 is reduced below a certain level (asis also described above), the moveable material 714 returns to itsmechanically relaxed state and the MEMS switch 700 is opened.

FIG. 8B is a top view of MEMS switch 700. The supports 718, theconductive strip 708, and the terminals 706 are shown as seen lookingthrough the moveable material 714. Conductive strip 708 may besignificantly smaller than the moveable material 714. This is to ensurethat the electromotive force between the moveable material 714 and theelectrode 702 is larger than the electromotive force between theconductive strip 708 and the electrode 702 because once the stripcontacts the electrodes, the potential on the strip may differ from thepotential on the moveable material.

FIG. 9 is a cross-sectional side view of a MEMS switch 800 of anotherembodiment. MEMS switch 800 has similar constructional features as theinterferometric modulator of FIG. 7C. It also has MEMS switchfunctionality and features similar to those of MEMS switch 700 in FIG.8A.

FIG. 10 is a cross-sectional side view of another MEMS electrical switchthat is similar to the switch of FIG. 8, except for the addition of“latch” electrodes 730 a, 730 b on the substrate, that are described infurther detail below. In FIG. 10, the switch is shown in the actuatedposition with the moveable material 714 deformed down onto the terminals706.

In operation, a relatively low voltage is initially applied toelectrodes 730 a, 730 b, creating a voltage difference between theelectrodes 730 a, 730 b and the moveable material 714. In advantageousembodiments of this design, this voltage difference is not of sufficientmagnitude to cause the moveable material 714 to deform from the relaxedstate into the actuated state, but is sufficient to maintain themoveable material in the actuated state once it is placed in that state.Subsequently, a voltage is applied to electrode 702 that creates avoltage difference between the moveable material 714 and the electrode702 that is of sufficient magnitude to cause the moveable material tocollapse towards the electrode 702. After the device is actuated by thisapplied voltage, the voltage on electrode 702 may be removed. Because ofthe close proximity of the moveable material 714 and the electrodes 730a, 730 b, the moveable material 714 may then be maintained in thecollapsed position by the voltage difference between the electrodes 730a, 730 b and the moveable material 714 even though the voltage appliedto the latch electrodes 730 a, 730 b is not high enough to actuate thedevice from the fully relaxed initial state. In one embodiment, thevoltage applied to latch electrodes 730 a, 730 b is in the range of 1-10volts, while the voltage applied to electrode 702 is in the range of5-15 volts. It will be appreciated that the latch voltage could beapplied after the set voltage. It will also be appreciated that thelocation of the various components shown in FIG. 10 can be variedwidely. For example, the switch terminals 706 could be placed betweenthe support posts and the latch electrodes. The latch electrodes mayextend further toward and/or under the support posts. In addition, onlyone, or more than two latch electrodes could be provided. The importantfeature is that the latch electrode(s) be placed in a position thatprovides the latch function. In the embodiment, of FIG. 10, it isadvantageous to have at least a portion of the latch electrodes placedbeneath the point where the moveable material forms a corner and firstcontacts the substrate.

FIG. 11 illustrates a schematic/block diagram of this switch embodiment.A SET signal is applied to electrode 702 and a LATCH signal is appliedto electrodes 730A and 730 b. The LATCH signal may be a lower voltagethan the SET signal. Once LATCH is asserted, the SET signal can beasserted to close the switch. De-asserting the SET signal does not relaxthe device and open the switch unless the LATCH signal is also removed.With this design, a group of switches can be configured as desired byasserting a common LATCH signal and using a defined group of SET signalsrouted to individual central electrodes, after which the SET signals cantake on any value without changing the switch states. The entire groupcan be cleared simultaneously by de-asserting all SET and LATCH signals.

While the above detailed description has shown, described, and pointedout novel features as applied to various embodiments, it will beunderstood that various omissions, substitutions, and changes in theform and details of the device or process illustrated may be made bythose skilled in the art without departing from the spirit of theinvention. As will be recognized, the present invention may be embodiedwithin a form that does not provide all of the features and benefits setforth herein, as some features may be used or practiced separately fromothers.

1. A MEMS switch device comprising: a set electrode; anelectrostatically moveable electrode, configured to actuate to anactuated position based on electrostatic attraction between the moveableelectrode and the set electrode; at least two switch terminals that areselectably electrically connected to each other or disconnected fromeach other based at least in part on the position of the moveableelectrode; and a latch electrode, wherein the moveable electrode isconfigured to be maintained in substantially the actuated position basedon electrostatic attraction between the moveable electrode and the latchelectrode.
 2. The MEMS device of claim 1, further comprising asubstrate, wherein the substrate and the moveable electrode form acollapsible cavity, the cavity being collapsed based on the position ofthe moveable electrode.
 3. A display system comprising: an array of MEMSdisplay elements; and one or more MEMS switches coupled to the array,wherein at least one of the MEMS switches comprises: a set electrode; anelectrostatically moveable electrode, configured to actuate to anactuated position based on electrostatic attraction between the moveableelectrode and the set electrode; at least two switch terminals that areselectably electrically connected to each other or disconnected fromeach other based at least in part on the position of the moveableelectrode; and a latch electrode, wherein the moveable electrode isconfigured to be maintained in substantially the actuated position basedon electrostatic attraction between the moveable electrode and the latchelectrode.
 4. The MEMS device of claim 3, further comprising asubstrate, wherein the substrate and the moveable electrode form acollapsible cavity, the cavity being collapsed based on the position ofthe moveable electrode.
 5. The display system of claim 4, wherein atleast one of the display elements comprises another moveable electrode,wherein the substrate and the other moveable electrode form anothercollapsible cavity, the other cavity being collapsed based on theposition of the other moveable electrode.
 6. The MEMS device of claim 3,wherein the set electrode is in a central region between two supportposts.
 7. The MEMS device of claim 6, wherein the latch electrode ispositioned between the central region and one of the support posts. 8.The MEMS device of claim 6, wherein the latch electrode is positionedbetween one of the switch terminals and one of the support posts.
 9. TheMEMS device of claim 3, wherein the set electrode is in a central regionof the device, and the latch electrode is electrically isolated from theset electrode.
 10. The MEMS device of claim 4, wherein the switchterminals are supported by the substrate.
 11. The MEMS device of claim4, wherein the switch terminals are connected when the moveableelectrode is positioned proximate to the substrate.
 12. The displaysystem of claim 3, further comprising: a processor that is in electricalcommunication with the display, the processor being configured toprocess image data; and a memory device in electrical communication withthe processor.
 13. The display system of claim 12, additionallycomprising a driver circuit coupled to the array.
 14. The device ofclaim 13, wherein the driver circuit is configured to send at least onesignal to the display.
 15. The device of claim 14, further comprising: acontroller configured to send at least a portion of the image data tothe driver circuit.
 16. The device of claim 12, further comprising: animage source module configured to send the image data to the processor.17. The device of claim 16, wherein the image source module comprises atleast one of a receiver, transceiver, and transmitter.
 18. The device ofclaim 12, further comprising: an input device configured to receiveinput data and to communicate the input data to the processor.
 19. Amethod of operating a MEMS switch comprising: electrically connecting toeach other or disconnecting from each other first and second electricalcomponents by moving an electrostatically moveable element from a firstposition to a second position by applying a first voltage across a setelectrode and the moveable element, the first voltage establishing anelectrostatic attraction between the set electrode and a central portionof the moveable element; and maintaining the moveable element in thesecond position by applying a second voltage across the moveable elementand a latch electrode, the second voltage establishing an electrostaticattraction between the latch electrode and the moveable element,respectively.
 20. The method of claim 19, wherein the second voltage isless than the first voltage.
 21. A method of making a MEMS switchcomprising: forming switch terminals between a pair of support posts ona substrate; forming an electrostatically moveable electrode on thesupport posts; and forming a latch electrode between the support postsadjacent the moveable electrode; and forming a set electrode between thesupport posts adjacent the moveable electrode, wherein the moveableelectrode is configured to actuate to an actuated position based onelectrostatic attraction between the moveable electrode and the setelectrode, and is configured to be maintained in substantially theactuated position based on electrostatic attraction between the moveableelectrode and the latch electrode, and wherein the moveable electrode isconfigured to electrically connect the switch terminals to each otherwhen in the actuated position and disconnect the switch terminals fromeach other when no in the actuated position.
 22. The method of claim 21,comprising forming the set electrode in a central region of the MEMSswitch.
 23. The method of claim 21, comprising forming the latchelectrode between the central region and one of the support posts, thelatch electrode being electrically isolated from the set electrode. 24.A MEMS switch made with the method of claim
 21. 25. A MEMS switchcomprising: means for electrically connecting to each other ordisconnecting from each other first and second electrical components,wherein the electrically connecting or disconnecting means is configuredto move from a first position to a second position; means for moving theelectrically connecting or disconnecting means from the first positionto the second position, the moving means being configured to apply afirst voltage across a set electrode and the electrically connecting ordisconnecting means, the first voltage establishing an electrostaticattraction between the set electrode and a central portion of theelectrically connecting or disconnecting means; and means formaintaining the electrically connecting or disconnecting means in thesecond position, the maintaining means being configured to apply asecond voltage across the electrically connecting or disconnecting meansand a latch electrode, the second voltage establishing an electrostaticattraction between the latch electrode and the electrically connectingor disconnecting means, respectively.
 26. The MEMS switch of claim 25,wherein the moving means comprises a first electrode.
 27. The MEMSswitch of claim 25, wherein the maintaining means comprises a secondelectrode.